IPC A 610 EXAM LATEST 2023-2024 ACTUAL EXAM 100 QUESTIONS AND CORRECT DETAILED ANSWERS WITH RATIONALES|AGRADE

IPC A 610 EXAM LATEST 2023-2024 ACTUAL EXAM 100

QUESTIONS AND CORRECT DETAILED ANSWERS WITH

RATIONALES|AGRADE

What is the purpose of Conformal Coating? - ANSWER- Conformal

coatings can be used in a wide range of environments to protect printed

circuit boards from moisture, salt spray, chemicals and temperature

extremes in order to prevent such things as corrosion, mold growth, and

electrical failures.

Measuring wet coating (2)

Wet Film Comb - ANSWER- Most common method to measure wet

coating. The gauge consists of a series of combs with different distance

between the marked points and the baseline. After placing the comb into

the wet coating film, the thickness can be measured in Microns or Mils.

Measurement determined by the number between the last tooth coated

and the following tooth which is free of coating.

Measuring wet coating (2)

Wet Film Wheel - ANSWER- Method to measure wet coating using two

outer wheels fixed to a central spindle wheel. Thickness is measured by

rolling the wheel on the maximum scale towards accurately ground zero.

When rolling the wheel on the coated board, the central wheel will touch

the coating. The first point of contact on the central wheel determines

the wet film thickness.

Measling - ANSWER- Internal condition occurring in laminated base

material in which the glass fibers are separated from the resin at the

weave intersection. This condition manifests itself in the form of discrete

white spots or crosses below the surface of the base material, and is

usually related to THERMALLY INDUCED STRESS.

Crazing - ANSWER- Internal condition occurring in the laminated base

material in which the glass fibers are separated from the resin at the

weave intersections. This condition manifests itself in the form of

CONNECTED white spots or crosses below the surface of the base

material and usually related to MECHANICALLY INDUCED STRESS.

Blistering - ANSWER- Delamination in the form of a localized swelling

and separation between any of the layers of a lamination base material,

or between base material and conductive foil or protective coating.

Delamination - ANSWER- Separation between plies within base

material, between a base material and a conductive foil or any other

planar separation within a printed board.

Weave Texture - ANSWER- Surface condition of a base material in

which a weave pattern of glass cloth is apparent although the unbroken

fibers are completely covered with resin.

Weave Exposure - ANSWER- Surface condition of a base material in

which the unbroken fibers of woven glass cloth are NOT completely

covered by resin.

Haloing - ANSWER- condition existing in the base material in the form

of a light area around holes or other machined areas on or below the

surface of the base material. Mechanically induced fracturing or

delamination on or below the surface of the base material; a Light area

around the holes, other machined areas or both.

(a light ring around a hole on a circuit board)

FOD (Foreign Object Debris) - ANSWER- A generic term for a

substance, debris, particulate matter or article alien to the assembly or

system.

ex: wire and lead clippings, hair, dust, non-ESD safe objects.

Solder Mask Coating - ANSWER- Heat-resisting coating material

applied to selected areas to prevent the deposition of solder upon those

areas during subsequent soldering. Solder Mask material may be applied

as a liquid or a dry film. (ex: pink masking)

Conformal Coating - ANSWER- Provides a barrier layer to the surface

of an electronic assembly to provide protection against the end use

environment.

-distribution depends partly on the method of application and may affect

visual appearance and corner coverage.

Dipping - ANSWER- May have a drip line or localized build-up on the

edge of the board. This build-up may contain small amount of bubbles

but it will not affect the functionality or reliability of the coating.

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